Cloe 10 SP5-D DLC
Packing 10 dual-processor nodes into a single 6U front-access chassis, this high-density blade server combines the raw core density of AMD EPYC™ 9005-series processors with a fully integrated direct liquid cooling manifold, delivering up to 92% heat capture in a standard rack footprint.
| Cooling system: Direct Liquid Cooling |
| CPU brand: AMD |
| CPU socket: SP5 (LGA 6096) |
| Number of sockets: 2 per node |
| Memory slots: 24 slots |
| Form factor: 19" 6U |
Maximum compute density, minimum footprint
When rack space is scarce and workload density is high, every U counts. This 6U 10-Node DLC blade server fits 10 fully independent compute nodes into a single 6U chassis, that's 20 processors, 240 DIMM slots and 20 E3.S Gen5 NVMe bays, all liquid-cooled, all front-accessible.
Each node runs independently with its own OS, its own storage and its own PCIe expansion. The chassis manages power and cooling centrally, with 6+6 redundant 3200W 80 PLUS Titanium power supplies and a fully integrated DLC manifold keeping every node stable at sustained load.
Designed for:
- Hyperscale and cloud-native infrastructure
- HPC clusters requiring maximum node density per rack
- Hybrid and private cloud deployments
- High-throughput networking and data analytics
- Operators looking to reduce PUE without major facility changes
Full-system DLC with integrated manifold: 92% heat capture
The entire thermal architecture of this system is built around a single integrated liquid cooling manifold. Every heat-generating component (CPUs, memory, storage, PCIe cards) has a dedicated cold plate connected to the same coolant loop.
The result is a 92% heat capture ratio (HCR): the vast majority of the heat produced never reaches the ambient air. This means:
- Drastically reduced fan load, only 4 x 80mm system fans for the entire 6U chassis
- Compatibility with warm water cooling up to 45°C inlet temperature, no chilled water required
- A significantly lower PUE, even in facilities with limited air cooling capacity
- Stable, sustained compute performance with no thermal throttling
The manifold design also simplifies servicing, all nodes are front-accessible without disturbing the cooling loop.
The liquid coolant contained within the tubes, is a mixture of demineralized water and propylene glycol with the following beneficial features: Anti-Freeze, Anti-Corrosion and Anti Bacterial.
Illustration: Liquid Cooled components
Peak performance, sustained
Liquid-cooled components run well within their thermal limits, keeping servers stable and delivering consistently high performance.
Lower power, same output
Fewer fans, lower speeds, same performance: liquid-cooled servers match air-cooled output while drawing less power.
Quiet operation
Air cooling means banks of high-speed, high-noise fans. 2CRSi's liquid cooling cuts fan count, and noise, dramatically.
Decades of cooling expertise
Our liquid cooling supplier brings 20 years of cooling expertise across desktop PCs and data centers, backed by 2CRSi's own 10+ years in the field.
Built to run and last
Liquid cooling systems are monitored continuously and need little maintenance, with component warranties from 2CRSi and our cooling partners.
Ease of use
2CRSi servers with liquid cooling kits mount straight into a rack or tie into a building's water system, with quick, easy, dry-break disconnects.
AMD EPYC™ 5th Gen
AMD EPYC™ 9005 series processors bring the mature SP5 platform to its most refined form, built on a 3nm process with "Zen 5" and "Zen 5c" cores for up to 192 cores per CPU and increased compute density.
A larger L3 cache of up to 512MB reduces latency for data-intensive workloads, while 12 memory channels support up to 9TB of DDR5 in a 2-DIMM-per-channel configuration.
Up to 160 PCIe lanes per socket deliver extensive I/O connectivity in dual-socket designs, and CXL 2.0 support enables disaggregated compute architectures for greater memory and resource flexibility.
